TECHNICAL ALLIANCE BRIDGE

The skills of TAB members are shown at the right.  Click on any member name for a short resume page about that member.

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TAB SKILLS

Analog Circuit Design: Carl Angotti, Sam Burd, Pierre Dermy, Walt Maclay

Analysis, FEA and CFD: Metin Ozen, Ann Roberts

Antenna, Small Array, Printed, patch: Pierre Dermy

ASIC Design: Pierre Dermy

ASIC Manufacturing Services: Pierre Dermy

CAD/ Solid Modeling: Sam Burd, Richard Freeman, Jim Mielke, Thomas Roberts, Loren Stirling, Dick Yokota

Contract Manufacture: Sam Burd, Richard Freeman, Thomas Roberts

Design Engineering: Sam Burd, Dr. John T. Davies, Richard Freeman, Walt Maclay, Jim Mielke, Ann Roberts, Dick Yokota

DFM - Design for Manufacturability: Pierre Dermy

DFT - Design for Testability: Pierre Dermy

DFY - Design for Yield: Pierre Dermy

Digital Circuit Design: Pierre Dermy, Walt Maclay

Design for Manufacture: Sam Burd, Richard Freeman, Ann Roberts, Thomas Roberts, Mike Silverman, Loren Stirling, Dick Yokota

Design Optimization Engine: Pierre Dermy

Electrical Engineering: Carl Angotti, Sam Burd, Walt Maclay, Larry Polyak

Electronic System Design: Pierre Dermy

Embedded Processor and Microcontroller: Pierre Dermy

EMI Design: Carl Angotti , Walt Maclay, Jim Mielke, Mike Silverman

EMI RFI Shielding: Pierre Dermy

Ergonomics: Jim Mielke, Loren Stirling

ESD Protection: Pierre Dermy

FPGAs: Pierre Dermy, Walt Maclay

Graphic Design: Jim Mielke, Loren Stirling

HALT/HASS: Mike Silverman

Hardware Design: Carl Angotti, Sam Burd, Dr. John T. Davies, Pierre Dermy, Richard Freeman, Walt Maclay, Jim Mielke, Thomas Roberts

High-voltage Electronic Design: Pierre Dermy

Industrial Design: Sam Burd, Richard Freeman, Jim Mielke, Thomas Roberts, Loren Stirling

Integrated Circuit Design: Pierre Dermy

Interactive Design: Loren Stirling

Laser Systems: Sam Burd , Walt Maclay, Thomas Roberts

Machine Design: Sam Burd, Thomas Roberts, Loren Stirling, Dick Yokota

Manufacturing: Richard Freeman, Thomas Roberts

Mechanical Engineering: Richard Freeman, Sam Burd, Thomas Roberts, Loren Stirling, Dick Yokota

MEMS: Sam Burd, Dr. John T. Davies , Walt Maclay, Thomas Roberts

Micropower Electronic and IC Design: Pierre Dermy

Microprocessor: Carl Angotti, Sam Burd , Pierre Dermy, Walt Maclay, Larry Polyak

MIL Standard Testing: Mike Silverman

Mold Flow: Dick Yokota

MMIC - Monolithic Microwave IC Design: Pierre Dermy

Nanotechnology: Sam Burd

Optical Design: Sam Burd, Thomas Roberts

Packaging: Mike Silverman

Plasma Technology: Dr. John T. Davies, Thomas Roberts

Plastics: Sam Burd, Richard Freeman, Jim Mielke, Thomas Roberts, Loren Stirling, Dick Yokota

Power Management and Distribution: Pierre Dermy

Power Supply Design: Carl Angotti, Pierre Dermy

PCB - Printed Circuit Board Design: Pierre Dermy

PCB - Printed Circuit Board Manufacturing: Pierre Dermy

Product Design: Sam Burd, Dr. John T. Davies, Richard Freeman , Walt Maclay, Jim Mielke, Ann Roberts, Thomas Roberts, Loren Stirling, Dick Yokota

Product Identity: Jim Mielke, Loren Stirling

Project Management: Carl Angotti, Sam Burd, Richard Freeman , Walt Maclay , Ann Roberts , Thomas Roberts, Loren Stirling, Dr. John T. Davies

Qualification Testing: Mike Silverman

Quality/ISO: Mike Silverman

RF IC and PCB Design: Pierre Dermy

RFID Tags and Base Station: Pierre Dermy

Rapid Prototyping and Models: Richard Freeman, Jim Mielke, Loren Stirling

Rapid Visualization: Richard Freeman, Jim Mielke, Loren Stirling

Regulatory Assistance: Carl Angotti, Sam Burd , Walt Maclay, Mike Silverman

RoHS: Mike Silverman

Reliability/Safety Analysis: Sam Burd , Walt Maclay, Mike Silverman

Semiconductor Equipment: Dr. John T. Davies , Thomas Roberts, Mike Silverman

Semiconductor Technologies: Pierre Dermy

SEMI Standards: Dr. John T. Davies, Mike Silverman

Silicon Foundry Services: Pierre Dermy

Simulation, Multiphysics: Pierre Dermy, Metin Ozen

Sensors: Walt Maclay

Semiconductor Reliability: Mike Silverman

Software: Sam Burd, Larry Hidenbrand , Walt Maclay, Larry Polyak

Software Reliability: Mike Silverman

Vacuum Technology: Dr. John T. Davies, Thomas Roberts

Wireless Communication Hardware: Pierre Dermy